| PART |
Description |
Maker |
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTT-MT-20.000 ZTT-MX-20.000 ZTT-MG-20.000 ZTA ZTA- |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| PG-TO251-3-21 |
Package Outline / Marking Layout
|
Infineon
|
| ILCX05-BB0318-20.000 ILCX05-BB1318-20.000 ILCX05-B |
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
|
ILSI America LLC
|
| J68.BPACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| AXX5032-2 |
Quartz Crystal Unit in SMD package 5.0x3.2 mm Resin sealed 2 pad
|
Advanced XTAL Products
|
| CB3LV-3I-25M0000-T CB3LV-3I-20M0000 CB3LV-3I-24M00 |
Standard 7.0mm x 5.0mm 4-Pad Surface Mount Package
HCMOS/TTL Clock Oscillator
|
CTS Corporation
|
| AD5405YCPZ-REEL7 |
Dual 12-Bit , High Bandwidth, Multiplying DAC with 4 Quadrant Resistors and Parallel Interface; Package: LFCSP (6x6mm w.4.1mm pad); No of Pins: 40; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
| AD9222BCPZRL7-65 |
Octal, 12-Bit, 40/50/65 MSPS Serial LVDS 1.8 V A/D Converter; Package: LFCSP (9x9mm, 7.10 exposed pad); No of Pins: 64; Temperature Range: Commercial 8-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, QCC64
|
Analog Devices, Inc.
|
